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Tokyo Electron Limited and ASML Accelerate Joint Development Activities

Tokyo Electron Limited (TEL) and ASML Holding NV (ASML) today announced an agreement to accelerate joint development activities of EUV (Extreme Ultraviolet) and ArF Immersion using state-of-the-art lithography clusters.

This agreement on joint development acceleration was made in order to meet increasing customers’ demand for leading edge systems capable of next generation chip production, namely EUV technology, which is the key lithography solution for 22nm and beyond, and extended ArF immersion, which remains a mainstream technology for critical layers of advanced chip production. Through this dual technology leadership strategy, TEL and ASML are aiming to strengthen our offerings to best support our customers for sub 20nm nodes development.

As part of this agreement, TEL and ASML will provide equipment at their respective facilities in Kumamoto, Japan and Veldhoven, the Netherlands to accelerate development, investigation and customer demonstration activities of the most advanced lithography technologies.